| 发明名称 |
Method of making split fin heat sink |
| 摘要 |
A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.
|
| 申请公布号 |
US7188418(B2) |
申请公布日期 |
2007.03.13 |
| 申请号 |
US20030701582 |
申请日期 |
2003.11.05 |
| 申请人 |
INTEL CORPORATION |
发明人 |
SHAH KETAN R. |
| 分类号 |
B21D53/02;B21D53/06;H01L21/48;H01L23/367;H01L23/467;H05K7/20 |
主分类号 |
B21D53/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
