| 摘要 |
A process for the accelerated cure of an epoxy resin is disclosed. The resulting epoxy resin may be used in protective coatings, adhesives, seamless and terrazo flooring and caulking and sealing compositions. The resulting resin is also useful, for example, in casting, potting, in escapulating, grouting and patching. The process involves mixing an epoxy resin of the polyhydric phenol, polyglycidyl ether type by mixing with an accelerator-hardener combination made up of (a) a liquid mixture of salicyclic acid and either iminobis(propylamine) or methyliminobis(propylamine) and (b) a polyoxyalkylenepolyamine and allowing the mixture to cure at ambient or elevated temperatures.
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