发明名称 MANUFACTURE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent damage of wafer, by providing a projecting part for reinforcement at the circumference of one plane of a semiconductor wafer and by forming the pattern of a planer type semiconductor device of another plane.
申请公布号 JPS53135568(A) 申请公布日期 1978.11.27
申请号 JP19770050438 申请日期 1977.04.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 OOTA AKIFUMI
分类号 H01L21/30;H01L21/02;H01L21/027;H01L21/302 主分类号 H01L21/30
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