| 摘要 |
A method and an arrangement to bond a die to a substrate of a die-substrate combination to form a microelectronic package. The method comprises: providing the die-substrate combination including a die, a substrate, pre-connection bumps and an underfill material, the pre-connection bumps and underfill material being disposed between the die and the substrate; forming joints from the pre-connection bumps at a joint formation site to obtain an intermediate package; curing the underfill material of the intermediate package at an underfill curing site to obtain the microelectronic package; using a conveying device to transfer the intermediate package from the joint formation site to the underfill curing site; and applying heat energy to the intermediate package during at least part of a transfer thereof from the joint formation site to the underfill curing site to control a temperature of the intermediate package.
|
