| 摘要 |
<p>The semiconductor mounting plate (1) has heat sink elements (4) attached to both its front and rear surfaces (2, 3). The latter each have two parallel grooves (5) extending across the width of the mounting plate (1) and receiving fixing nuts (7) allowing the heat sink elements (4) to be screwed to the mounting plate (1). Pref. each heat sink (4) comprises a metal profile with a number of parallel vanes. The front and rear surfaces (2, 3) of the mounting plate (1) or the facing surfaces of each heat sink (4) may be slightly convex in the region between the parallel grooves (5).</p> |
