| 发明名称 |
GRINDING STONE FOR SEMICONDUCTOR WAFER BEVEL |
| 摘要 |
PURPOSE:To effect an even and uniform edge bevel work on the end surface of a wafer, by making use of a grinder having a peripheral groove which is provided with grinding agent only at both side walls thereof.
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| 申请公布号 |
JPS53134294(A) |
申请公布日期 |
1978.11.22 |
| 申请号 |
JP19770048366 |
申请日期 |
1977.04.28 |
| 申请人 |
TOKYO SHIBAURA ELECTRIC CO |
发明人 |
INOKUCHI SEIJI;KUMAI HARUO |
| 分类号 |
B24D7/18;B24D3/00;H01L21/304 |
主分类号 |
B24D7/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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