发明名称 ELECTRONIC DEVICE PACKAGING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a liquid composition, which is suitable for printing ink or coating varnish for forming a cured insulating membrane for electric and electronic parts, as an insulating membrane liquid composition improved in low temperature curability and adhesion and forming the cured insulating membrane, which has good adhesion with a substrate and a seal material, by heat-treating at a low temperature of about 120°C or lower after application to the substrate. SOLUTION: A polyimide siloxane composition, which is improved in low temperature curability and adhesion, for an insulating membrane contains (a) 100 pts.wt. of an organic solvent-soluble polyimide siloxane, (b) 2-40 pts.wt. of a polyvalent isocyanate, (c) 0.1-30 pts.wt. of an epoxy compound and (d) an organic solvent. This polyimde siloxane composition for an insulating membrane, the cured insulating membrane formed by heat-treating the composition for an insulating membrane, and a formation method of the cured insulating membrane are provided. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008308694(A) 申请公布日期 2008.12.25
申请号 JP20080191775 申请日期 2008.07.25
申请人 UBE IND LTD 发明人 NAIKI MASAHIRO;KIUCHI MASAYUKI;TANAKA YOSHIKI;ISHIKAWA SEIJI;MATSUI YUJI
分类号 C09D179/08;C08G18/58;C08G18/60;C09D5/25;C09D7/12;C09D163/00;C09D175/12;C09D183/04;H01L21/312 主分类号 C09D179/08
代理机构 代理人
主权项
地址