发明名称 ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive composition, having preservation stability even in the case of using metal particles of nickel or the like as conductive particles, and hardly causing corrosion after connection. SOLUTION: This anisotropic conductive adhesive composition contains an adhesive binder and conductive particles obtained by covering the metal particles with a metal selected from a group composed of gold, platinum, silver and copper through a sputtering process. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008308537(A) 申请公布日期 2008.12.25
申请号 JP20070155997 申请日期 2007.06.13
申请人 HITACHI CHEM CO LTD 发明人 FUJINAWA MITSUGI
分类号 C09J9/02;C09J11/04;C09J201/00;H01B1/00;H01B1/22;H01R11/01;H05K1/09 主分类号 C09J9/02
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