| 发明名称 |
MOUNT MATERIAL FOR DIAMOND DIE |
| 摘要 |
PURPOSE:The developement of the mount material for diamond die having excellent rigidity, which is obtained by using the granular superhard alloy and silver solder, copper solder, etc. as the reinforcing materials. |
| 申请公布号 |
JPS53133512(A) |
申请公布日期 |
1978.11.21 |
| 申请号 |
JP19770048919 |
申请日期 |
1977.04.26 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES |
发明人 |
HARA AKIO;YATSU SHIYUUJI |
| 分类号 |
B21C3/02;B22F7/00;B23K1/00;B23K35/22;B23K35/24;C22C26/00 |
主分类号 |
B21C3/02 |
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