发明名称 LIGHT EMITTING DEVICE
摘要 The LED device is provided to improve the light transmission by using glass as sealing member for LED chip. The LED device is formed with the lead frame and has the first and second leads(11,12) connected to the outer electrodes, and the package body(13). The package body is made of the ceramic material. The other end of the first and the second lead is protruded to the outside of the package body. The package body fixes the first and the second lead. The package body has the cavity(19) exposing the first and the second lead. The inner wall of cavity has the incline In order to reflect the light emitted in the LED chip to outside.
申请公布号 KR20090001881(A) 申请公布日期 2009.01.09
申请号 KR20070052025 申请日期 2007.05.29
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 SEO, JUNG HOO
分类号 H01L33/00D04;H01L33/00D01 主分类号 H01L33/00D04
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