| 摘要 |
A glass sealed semiconductor package (10) includes a metal base number (12), a metal housing or lid member (14) shaped to provide a hollow enclosure (16) for receiving an electronic component (18). A leadframe (20) with a top surface (29) is sealed between the cover (14) and base (12) by a sealing glass (22) such as a lead borate type glass and filler. The leadframe (20) is constructed from a precipitation hardenable copper alloy which is relatively soft prior to exposure to the glass sealing times and temperatures and the leadframe legs (24, 26) may be readily bent to a desired radius. The leadframe is much harder subsequent to the exposure to the glass sealing times and temperatures and resists flexure. |
