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发明名称
METALLIC BONDED STRUCTURE OF SEMICONDUCTOR DEVICE
摘要
PURPOSE:To provide sound connection with electrodes by using an A wire containing at least one of silver and tin.
申请公布号
JPS53132263(A)
申请公布日期
1978.11.17
申请号
JP19770046864
申请日期
1977.04.25
申请人
发明人
分类号
H01L21/60;H01L23/48
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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