MOLDING PRESS OF SEMICONDUCTOR CHIP

摘要

PURPOSE:To execute a molding press operation favorably at high speed by a method wherein a molding substance is molded while the timing just before an internal pressure of a cavity is raised suddenly is used as the changeover timing to switch a feed pressure of a molten resin from a high pressure to a low pressure in order to detect the best changeover timing from the high pressure to the low pressure. CONSTITUTION:A lead frame where a semiconductor chip has been placed is set between an upper metal mold 6 and a lower metal mold 5 of a molding press apparatus; a tablet 17 attached to the lower metal mold 5 is pushed up by using a plunger 25; the heated and molten tablet 17 is pushed into a cavity 19 of the upper metal mold 6 and the lower metal mold 5 where a molding substance 17a of a semiconductor chip is molded. Then, a situation that an internal pressure of the cavity 19 has been raised suddenly and that the cavity 19 has been filled with a molten resin of the tablet 17 is detected with a pressure-sensing apparatus 34 to which its internal pressure is transmitted via an ejector pin 21 for pushing-up use of the molding substance 17a; the time until the cavity becomes full is measured; after that, the time just before it becomes full is used as the changeover timing to switch a feed pressure of the molten resin from a high pressure to a low pressure; the molding substance 17a is molded.