发明名称 WERKWIJZE VOOR HET VERBETEREN VAN HET HECHTEND VERMOGEN VAN EEN KOPERFOELIE OP EEN ONDERLAAG, ALSMEDE PLAAT, VERKREGEN MET BEHULP VAN DEZE WERKWIJZE.
摘要 Copper foil is subjected to a two-step electrochemical copper treatment to improve its bond strength, the first step of said treatment involving the use of a copper and arsenic-containing electrolyte. A treatment involving the use of the aforementioned two-step electrochemical copper pretreatment prior to the application of an electrochemical copper treatment. Treated copper foil and printed circuit boards resulting therefrom.
申请公布号 NL158560(B) 申请公布日期 1978.11.15
申请号 NL19720013582 申请日期 1972.10.06
申请人 YATES INDUSTRIES, INC., BORDENTOWN, NEW JERSEY, VER. ST. V. AM. 发明人
分类号 B21C37/02;B32B15/01;B32B15/04;B32B15/08;C07D239/54;C07D239/553;C25D3/58;C25D5/10;C25D5/16;C25D7/06;G01N33/00;H05K3/38;(IPC1-7):25D3/38 主分类号 B21C37/02
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