发明名称 |
WERKWIJZE VOOR HET VERBETEREN VAN HET HECHTEND VERMOGEN VAN EEN KOPERFOELIE OP EEN ONDERLAAG, ALSMEDE PLAAT, VERKREGEN MET BEHULP VAN DEZE WERKWIJZE. |
摘要 |
Copper foil is subjected to a two-step electrochemical copper treatment to improve its bond strength, the first step of said treatment involving the use of a copper and arsenic-containing electrolyte. A treatment involving the use of the aforementioned two-step electrochemical copper pretreatment prior to the application of an electrochemical copper treatment. Treated copper foil and printed circuit boards resulting therefrom. |
申请公布号 |
NL158560(B) |
申请公布日期 |
1978.11.15 |
申请号 |
NL19720013582 |
申请日期 |
1972.10.06 |
申请人 |
YATES INDUSTRIES, INC., BORDENTOWN, NEW JERSEY, VER. ST. V. AM. |
发明人 |
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分类号 |
B21C37/02;B32B15/01;B32B15/04;B32B15/08;C07D239/54;C07D239/553;C25D3/58;C25D5/10;C25D5/16;C25D7/06;G01N33/00;H05K3/38;(IPC1-7):25D3/38 |
主分类号 |
B21C37/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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