MANUFACTURING METHOD OF CHIP ELECTRONIC COMPONENT

摘要

The present invention relates to a method for manufacturing a chip electronic component which has high inductance (L), excellent Q properties (quality factor), and DC-bias properties (inductance variation properties by applying current). The method for manufacturing a chip electronic component comprises the following steps of: forming a magnetic material main body having an inner coil unit embedded therein; and forming a cover unit including a metal magnetic plate in at least one of upper and lower parts of the magnetic material main body.