| 摘要 |
<p>A process for producing a solder-rejecting protection on circuit boards including applying a viscous auxiliary lacquer to the top of a circuit board, pressing the auxiliary lacquer through apertures in the circuit board to cover solder edges on the solder side of the circuit board, applying a solder-rejecting substance to the solder side to cover conductor paths, and removing the auxiliary lacquer by a solvent to leave the solder edges free for the application of a solder.</p> |
