发明名称 ELECTRONIC PART
摘要 PURPOSE:To make an assembled body thinner for miniaturization by a method wherein a substrate comprising a thin film is inserted into a case while a thin metallic sheet sliding piece is inserted into a sliding type body. CONSTITUTION:A resin mold case 1 made of a case 11 integrated with a flexible substrate 13 is manufactured by inserting the substrate 13 comprising a flexible thin film into the synthetic resin made case 11. On the other hand, a slider 2 is manufactured by integrating a sliding piece 23 with a sliding type body 21 by inserting the metallic sliding piece 23 into the synthetic resin made sliding type body 21. Next, the slider 2 is contained in the resin mold case 1 to be covered with a cover 3 and then the cover 3 is fixed on the case 1 using the pawls 31 of the cover 3 as well as the protrusions 115 of the case 1. At this time, the contacts 231 of the slider 2 come into sliding-contact with the resin pattern 131 to produce a rotary variable resistor. In such a constitution, the case 1 and the slider 2 can be easily integrated with each other so that the mutual assembling of parts may be facilitated to produce a thin and compact resistor. In such a constitution, the case 1 and the slider 2 can easily be integrated with each other so that the mutual assembling of parts may be facilitated to produce a thin and compact resistor.
申请公布号 JPH02170403(A) 申请公布日期 1990.07.02
申请号 JP19880325652 申请日期 1988.12.22
申请人 TEIKOKU TSUSHIN KOGYO CO LTD 发明人 YAGI NOBUYUKI;INAGAKI JIRO;MORITA KOZO;KAKO YASUTOSHI;MIZUNO SHINJI;HARI ATSUSHI
分类号 H01C1/02;H01C1/12;H01C10/32;H01C10/44;H01H15/04;H01H19/00 主分类号 H01C1/02
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