Thick film potted circuit prodn. - involves mounting circuit components on support inserted into case filled with suitable plastics compound

摘要

The circuit has several components which are not of the thick film type, and it is produced on a substrate (1). The whole circuit may be potted in a suitable plastics compound. The substrate (1) with the thick film circuit is on one side of an assembly support (3), and the components not of the thick film type are on its other side and in contact with the circuit. The assembly support (3) is inserted into a case (8) which is open on one side and which is sealed to it by a suitable sealing compound (12). The case (8) is filled with a suitable plastics compound to protect all the electrical circuits.