发明名称 |
FOCAL PLANE ARRAY PACKAGING USING ISOSTATIC PRESSURE PROCESSING |
摘要 |
A method for bonding a first semiconductor body having a plurality of electromagnetic radiation detectors to a second semiconductor body having read out integrated circuits for the detectors. The method includes: aligning electrical contacts for the plurality of electromagnetic radiation detectors with electrical contacts of the read out integrated circuits; tacking the aligned electrical contacts for the plurality of electromagnetic radiation detectors with electrical contacts of the read out integrated circuits to form an intermediate stage structure; packaging the intermediate stage structure into a vacuum sealed electrostatic shielding container having flexible walls; inserting the package with the intermediate stage structure therein into an isostatic pressure chamber; and applying the isostatic pressure to the intermediate stage structure through walls of the container. The container includes a stand-off to space walls of the container from edges of the first semiconductor body. |
申请公布号 |
EP3061125(A1) |
申请公布日期 |
2016.08.31 |
申请号 |
EP20140793344 |
申请日期 |
2014.10.01 |
申请人 |
RAYTHEON COMPANY |
发明人 |
GERBER, KENNETH, ALLEN;GETTY, JONATHAN;RAMIREZ, AARON, M.;MILLER, SCOTT, S. |
分类号 |
H01L21/603;H01L21/67;H01L27/146 |
主分类号 |
H01L21/603 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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