| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing device capable of cutting a semiconductor wafer, having a diameter larger than that of the suction part of a table, well in a form where the semiconductor wafer is stuck to a tape, and to provide a table for the dicing device.SOLUTION: The table 18 of a dicing device 10 includes a suction part 34 for suction holding semiconductor wafers W1, W2, and a body 44 disposed on the outside of the suction part 34. A suction port 46 is formed in the upper surface 44A of the body 44, around the suction part 34. The suction port 46 is connected with a vacuum pump 50 via a vent 48. When the vacuum pump 50 is driven, the air in the vent 48 is sucked, and a tape 36 located on the outside of the suction part 34 is suction held by the suction port 46. Consequently, the outer periphery of the semiconductor wafer W1 located on the outside of the suction part 34 is suction held stably to the table 18 via the tape 36.SELECTED DRAWING: Figure 3 |
