| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device and positioning control method of the semiconductor manufacturing device that can deal with instantaneous stopping or instantaneous voltage drop without requiring securement of additional components or layout locations.SOLUTION: A semiconductor manufacturing device 10 comprises: each of motor drive units 80, 82 and 84 of each movement unit of an X-axis movement unit 20, Y-axis movement unit 22 and Z-axis movement unit 24 that move a stage 16; a control unit 86 that controls each motor drive unit; an amplifier 90 that amplifies a control signal from the control unit 86; and a computation unit 88 that determines a maximum allowable velocity Vin which motors 44, 58 and 74 normally drive by a capacitor capacitance of the amplifier at a time when instantaneous stopping or instantaneous voltage drop occurs in an acceleration period or deceleration period in each movement unit, obtains a maximum allowable amount of displacement Xfrom the maximum allowable velocity V, and computes an upper limit velocity Vof each movement unit so as to be equal to or less than the maximum allowable amount of displacement Xin a sequential operation or composite operation of each movement unit. The control unit 86 is configured to a velocity of each movement unit so as not to exceed the upper limit velocity Vcomputed by the computation unit 88.SELECTED DRAWING: Figure 1 |
