发明名称 Display module manufacturing method and display module
摘要 The present invention provides a manufacturing method of a display module, including a step of disposing a substrate on a transparent carrier plate, wherein the substrate has a bottom surface and a supporting surface opposite to the bottom surface; the bottom surface is attached to the transparent carrier plate and includes a first area and a second area. A step of performing a display elements manufacturing process on the supporting surface. A step of etching the first area by a first energy having a first energy density passing through the transparent carrier plate to separate the first area from the transparent carrier plate. A step of etching the second area by a second energy having a second energy density passing through the transparent carrier plate to separate the second area from the transparent carrier plate, wherein the second energy density is greater than the first energy density. A step of separating the substrate from the transparent carrier plate.
申请公布号 US9437822(B2) 申请公布日期 2016.09.06
申请号 US201514727415 申请日期 2015.06.01
申请人 AU OPTRONICS CORPORATION 发明人 Lin Jia-Hua;Tsai Chih-Hung
分类号 H01L21/00;H01L51/00;H01L51/52;H05B33/08 主分类号 H01L21/00
代理机构 McClure, Qualey & Rodack, LLP 代理人 McClure, Qualey & Rodack, LLP
主权项 1. A manufacturing method of a display module, including: (a) disposing a substrate on a transparent carrier plate; wherein the substrate has a bottom surface and a supporting surface opposite to the bottom surface; the bottom surface is attached to the transparent carrier plate and includes a first area and a second area; (b) performing a display elements manufacturing process on the supporting surface; (c) etching the first area by a first energy having a first energy density passing through the transparent carrier plate to separate the first area from the transparent carrier plate; (d) etching the second area by a second energy having a second energy density passing through the transparent carrier plate to separate the second area from the transparent carrier plate, wherein the second energy density is greater than the first energy density; (e) separating the substrate from the transparent carrier plate.
地址 Hsin-Chu TW