发明名称 Manufacturing method of semiconductor device including indium
摘要 A semiconductor device includes an electron transit layer configured to be formed on a substrate; an electron supply layer configured to be formed on the electron transit layer; an upper surface layer configured to be formed on the electron supply layer; a gate electrode configured to be formed on the electron supply layer or the upper surface layer; a source electrode and a drain electrode configured to be formed on the upper surface layer; and first conductivity-type regions configured to be formed in the upper surface layer and the electron supply layer immediately below regions where the source electrode and the drain electrode are formed. The electron supply layer is formed of a nitride semiconductor including In. The upper surface layer is formed of a material including a nitride of one or more elements selected among B, Al, and Ga.
申请公布号 US9437723(B2) 申请公布日期 2016.09.06
申请号 US201414445135 申请日期 2014.07.29
申请人 FUJITSU LIMITED 发明人 Nishimori Masato;Kikkawa Toshihide
分类号 H01L29/778;H01L29/66;H01L29/20;H01L21/265;H01L21/324;H01L29/51;H01L29/08;H01L29/417;H01L29/43 主分类号 H01L29/778
代理机构 Fujitsu Patent Center 代理人 Fujitsu Patent Center
主权项 1. A manufacturing method of the semiconductor device, the method further comprising: forming an electron transit layer, an electron supply layer, and an upper surface layer in order on a substrate by epitaxial growth; implanting ions of an impurity element of a first conductivity-type in regions immediately below where a source electrode and a drain electrode are to be formed in the electron supply layer and the upper surface layer; forming a heat-protective film on the upper surface layer after the implanting the ions of the impurity element of the first conductivity-type; and applying heat to activate the implanted ions so that the regions with the implanted ions become first conductivity-type regions; removing the heat-protective film and all of the upper surface layer; forming the source electrode and the drain electrode on one of the electron supply layer, and the electron transit layer; and forming a gate electrode on the electron supply layer, wherein the electron supply layer is formed of a nitride semiconductor including In, wherein the upper surface layer is formed of a material including a nitride of one or more elements selected among B, Al, and Ga.
地址 Kawasaki JP