VERKTYG FOR MIKROLODNING

摘要

A tool for micro-soldering the connecting tags of an integrated circuit chip to corresponding terminals on a substrate by Joule heating includes a high conductivity bit having a planar bottom face adapted to contact the tags and press them against the terminals while applying sufficient heat to the tags to solder them to the terminals. The face has a perimeter and a centrally apertured portion adapted to receive and accommodate the circuit chip. The apertured portion forms a geometric loop on the planar face having opposite sides spaced from each other and adapted to contact the tags of the chip. A continuous high electrical conductivity flange extends upwardly from all portions of the perimeter of the face to provide rigidity to the bit. A pair of high conductivity strips extend from facing segments of the flange for applying current to and removing current from the flange on opposite sides of the loop so that a pair of symmetrical current half loops extend about the face between the opposite sides thereof. Each strip has a reduced cross-sectional area symmetrical with the side of the face and removed from the intersection of the strip with the flange.