Process for producing cured products

摘要

Process for producing conductive cured products are disclosed. In one embodiment a copper compound is reacted with a reducing substance capable of reducing said copper compound to metallic copper, in the presence of a metallic copper powder on a substrate, thereby reducing the copper compound to metallic copper and forming a conductive connected unit of said metallic copper powder, and the connected unit is then subjected to cure molding with a resinous curable component to integrate the constituent elements into the conductive cured product. In a second embodiment, the ligand portion of a copper compound of a ligand capable of reducing copper in a compound state is reacted with the copper moiety present in said copper compound in the presence of a metallic copper powder on a substrate. The copper moiety is reduced and precipitated to form a conductive connected unit of a metallic copper powder and the connected unit is then subjected to cure molding with a resinous curable component.