发明名称 PRODUCTION OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To facilitate bonding operation by placing a plurality of lead wires on a heat sink mounted with an element, connecting the respective electrodes of the element and lead wires, thereafter letting the expandable insulator having been buried in the heat sink or lead wires expand to detach the respective lead wires from the heat sink.
申请公布号 JPS53119673(A) 申请公布日期 1978.10.19
申请号 JP19770034857 申请日期 1977.03.28
申请人 NIPPON ELECTRIC CO 发明人 AOKI TAKU
分类号 H01L23/50;H01L21/56;H01L21/58;H01L21/60 主分类号 H01L23/50
代理机构 代理人
主权项
地址