| 摘要 |
PURPOSE:To eliminate the need for a chip capacitor and enlarge selection range of mounting method by incorporating the capacitor into a ceramic container for constituting a package. CONSTITUTION:Two-layer conductor layers 3 and 4 are provided, sandwiching a dielectric layer near the bottom part of a ceramic container 2 with an element placing part 1. Then, a power supply terminal and a grounding terminal within an electrode pad 5 provided around the periphery of the element-placing part 1 are connected to the conductor layers 3 and 4 through wires 6a and 6b penetrating the ceramic container and then to outer leads 7a and 7b. Thus, the chip capacitor is needed and the selection range of mounting method can be enlarged without any restriction to heating temperature by a low-melting-point solder. |
