发明名称 |
MANUFACTURE OF SEMICONDUCTOR DEVICE |
摘要 |
<p>PURPOSE:To avoid crack occurrence to the glass protecting film which is coated on the mesa groove's slope, by providing an insulating film at the bottom of the mesa groove of the semiconductor wafer to prevent the glass coating and giving a ditch at the bottom of the groove after passivation to form a pellet.</p> |
申请公布号 |
JPS53118371(A) |
申请公布日期 |
1978.10.16 |
申请号 |
JP19770033482 |
申请日期 |
1977.03.25 |
申请人 |
NIPPON ELECTRIC CO |
发明人 |
KUROKI HAYASHI;YONEZAWA KEISHIROU |
分类号 |
H01L21/301;H01L21/302;H01L21/316 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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