Power semiconductor disc shaped component between flat heat sinks - has electrically insulating plate as thick as device with cavity at centre

摘要

A semiconductor device is used which consists of a disc shaped semiconductor component mounted between the flat surfaces of two heat sinks. The device is for power function on e.g. traction vehicles, and is protected from environmental effects. This will also reduce the chances of leakage currents. The plate (44) made from an electrically insulating material is fitted between the two heat sinks (2, 3). The thickness of the plate is approximately equal to the thickness of the semiconductor component (1). The semiconductor component is mounted in a cavity (4a) in the centre of the insulating plate. The chamber containing the element has a gas tight seal.