| 摘要 |
A lead frame stamped and formed from sheet metal and comprising a plurality of contact arms (1, 2, 3) arranged for connection to respective contact areas of an electronic component (100), each arm having integrally formed therewith a terminal tab (4, 5, 6) for connection to an external conductor, each tab being formed of a plurality of thicknesses of the sheet metal. The lead frame is part of a package in which it has an electronic component (100) mounted thereon with the contact arms (1, 2, 3) and associated terminal members (4, 5, 6) electrically isolated from each other, a substrate (18) of electrically insulating material being bonded to the contact arms (1, 2, 3), and a housing (21) in the form of a frame surrounding the substrate (18), component (100), contact arms (1, 2, 3) and portions of the tabs (4, 5, 6), with free end portions of the tabs (4, 5, 6) extending outside the housing (21), there being encapsulating material (24) filling the housing (21). |
