发明名称 FORMING METHOD FOR WIRING LAYER
摘要 PURPOSE:To make uniform the thickness of the protective film placed on the Au wiring later, by anode-oxidizing the Al layer formed on the plating ground while covering it with mask, leaving the Al layer covered with the mask in trapezoid, and removing it and implanting the concave with Au and further constituting it with the Au wiring layer in trapezoid.
申请公布号 JPS53116086(A) 申请公布日期 1978.10.11
申请号 JP19770030315 申请日期 1977.03.22
申请人 发明人
分类号 H05K3/46;H01L21/302;H01L21/306;H01L21/3205;H05K3/00 主分类号 H05K3/46
代理机构 代理人
主权项
地址