发明名称 |
Method of manufacturing thick-film circuit devices |
摘要 |
A method of manufacturing thick-film circuit devices which comprises depositing a photosensitive resin on a substrate either before or after the deposition of a paste for thick-film circuit, exposing the photosensitive resin selectively to light and thereby forming a predetermined thick-film paste pattern, and then firing the paste pattern.
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申请公布号 |
US4119480(A) |
申请公布日期 |
1978.10.10 |
申请号 |
US19770795446 |
申请日期 |
1977.05.10 |
申请人 |
TOKYO SHIBAURA ELECTRIC CO., LTD. |
发明人 |
NISHI, YUSAKU;FUJII, HIDEO |
分类号 |
G03F7/00;H01L21/70;H05K3/02;(IPC1-7):B05D3/06 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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