发明名称 HEAT TRANSFER STRUCTURE
摘要 <p>Disclosed is a heat exchange structure for transferring heat between first and second fluid media through a thermally conductive rigid structure which incorporates a passageway for the first medium and a plurality of flow paths for the second medium. The paths are defined between a plurality of layers of bodies which are bonded together and to the portions of the structure forming the passageway in regions of contact therewith forming a matrix and whose surfaces, which form the elemental surface areas of the flow paths, are predominantly convexly curved in all directions. The average length of the flow paths is not greater than 15 times the average radius of curvature of the elemental surface areas.</p>
申请公布号 CA1040025(A) 申请公布日期 1978.10.10
申请号 CA19680038832 申请日期 1968.12.27
申请人 RAYTHEON COMPANY 发明人 HAPGOOD, WILLIAM H.
分类号 F28F1/10;F22B27/14;F24H1/14;F24H1/16;F24H1/40;F28D17/00;F28F13/00;H01J19/36;H01L25/03;H05K7/20;(IPC1-7):28D7/00 主分类号 F28F1/10
代理机构 代理人
主权项
地址