发明名称 PATTERN FORMING METHOD
摘要 PURPOSE:To form an upper layer resist pattern which is vertical in profile and has no scum by executing a descum treatment after patterning. CONSTITUTION:The desired CMS (chrolo-methyl-stylene) resist pattern 4 is formed by exposing a CMS film 3 by using an excimer layer and developing the film and thereafter, the descum treatment is executed. Unnecessary org. matter is, therefore, removed and the CMS resist pattern 4 is trimmed by which the good pattern having no scum is obtd.; in addition, the crosslinking in the surface part of the CMS resist pattern 4 is progressed by the UV light radiated during discharge. Further, the crosslinking of the CMS resist pattern 4 is progressed by executing a heating and baking treatment to increase the absorption coefft. of light. A PMCI (polymethyl-glutarimide) film 2 is exposed over the entire surface by using the CMS resist pattern 4 as a mask and thereafter, the part where the PMGI film 2 is photodecomposed is dissolved away by an alkaline developing soln. The fine patterns of the two-layered resists are accurately formed in this way.
申请公布号 JPH02183255(A) 申请公布日期 1990.07.17
申请号 JP19890001985 申请日期 1989.01.10
申请人 OKI ELECTRIC IND CO LTD 发明人 SATO ISAO
分类号 G03F7/26;G03F7/38;G03F7/40;H01L21/027;H01L21/30 主分类号 G03F7/26
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