发明名称 VERFAHREN UND VORRICHTUNG ZUM MONTIEREN EINES ELEKTRISCHEN BAUELEMENTES AUF EINER LEITERPLATTE
摘要 A method of and arrangement for mounting an electric component, which comprises a holding socket having contact legs, on a circuit board. The holding socket is placed in a desirable position by inserting the contact legs into corresponding apertures of the circuit board, and is preliminarily fixed with respect to the circuit board by the use of a device in the shape of an apertured, non-conductive plate which is applied on the protruding contact legs on the opposite side of the circuit board. The plate retains the socket by friction forces which are present between one or more of the contact legs and the edges of pertaining apertures in the plate. Thereafter the wiring of the protruding legs is performed.
申请公布号 DE2809789(A1) 申请公布日期 1978.09.21
申请号 DE19782809789 申请日期 1978.03.07
申请人 NILSSON,SOEREN;CARNEBORN,ROLAND 发明人 NILSSON,SOEREN;CARNEBORN,ROLAND
分类号 H05K3/34;H05K3/30;H05K7/12;(IPC1-7):01L23/48;01L23/50 主分类号 H05K3/34
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