发明名称 Sealing porous chip-board edges - with compsn contg thermosetting resin modified by thermoplastic resin and contg hardener and filler
摘要 <p>Porous edges of chip- and fibre-board and similar cellulose-based products are coated and sealed with a soln. or dispersion of a thermosetting resin modified by a thermoplastic resin and contg. a hardener, a filler and opt. a mould parting agent and/or a pigment. Viscosity of compsn. should be adjusted to porosity of board edge, so that the limited penetration into porous pts. of edges is achieved and coating on edge surface forms a smooth, dense, easily coated-over layer after hardening. The method can be used in e.g. furniture mfr. Manual application of sealing putty or of strips fixed by melt adhesive is obviated. Viscosity of compsn. can be adjusted. Soiling of adjacent surfaces is prevented.</p>
申请公布号 IT1026252(B) 申请公布日期 1978.09.20
申请号 IT19750047550 申请日期 1975.01.07
申请人 AB CASCO 发明人
分类号 E04C;(IPC1-7):04C/ 主分类号 E04C
代理机构 代理人
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