| 摘要 |
Novel solvent soluble and injection moldable copolyamideimides are disclosed that are characterized in that from about 30 percent to about 70 percent of the recurring units are <IMAGE> and in the remaining 30-70 percent of the recurring units are <IMAGE> wherein CnH2n represents alkylene from 7 to 12 carbon atoms, inclusive, and Ar is <IMAGE> where X = -SO2-, -CO-, -O-, or alkylene (C1-4). The copolyamideimides are further characterized by ease of melt processing such as by extruding or injection molding while at the same time prossessing good high temperature stability and unexpectedly high impact and tensile yield strengths.
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