| 摘要 |
PURPOSE:To form a conductor layer in thickness of the same degree as that of a conductor layer formed on the surface of a printed board by laminating a protective film coated previously with resin on a surface layer copper foil. CONSTITUTION:A surface layer copper foil 4 is coated with a resin layer 21, a copper foil 22 is laminated thereon, a laminated board 5 is dipped in a plating catalyst solution, then the laminated layer 22 is removed, and an electroless plating and electrolytic copper plating are selectively performed only in a through hole 23 with the coating resin layer 21 as a plating resist film 27. After the coating resin 21 layer is peeled, a plating resist film 27 is formed on the surface layer copper foil 4, and a pattern copper 28 and a solder plating layer 29 are formed in the through hole 23 and the surface layer copper foil 4 with the resist film as a mask. Thus, the electrolytic copper plating layer is formed in a uniform thickness. |
