发明名称 ADHERING METHOD FOR SILICON SUBSTRATE
摘要 PURPOSE:To make the hardness of an Au leaf easy to process and to improve the adhesiveness through the composition of the brazing material, used for adhering a Ptype Si substrate to the substrate-supporting body, of a fixed amount of Ge and the Au leaf with the sufficient thickness needed for the adhesion.
申请公布号 JPS53105173(A) 申请公布日期 1978.09.13
申请号 JP19770012730 申请日期 1977.02.07
申请人 发明人
分类号 H01L23/12;H01L21/52;H01L21/58 主分类号 H01L23/12
代理机构 代理人
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