发明名称 POWER DISTRIBUTION BUS FOR INTEGRATED CIRCUITS
摘要 <p>IMPROVEMENTS RELATING TO SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES A power bus element for use in large scale integrated circuits is described. Each bus element consists, for example, of a chip of silicon having two levels of metallizationthereon, one acting as an earth (or ground) return plane and the other providing power voltages. Dependent contacts on the chip make selective contact with metallization over the surface of the semiconductor wafer on which the chip is mounted. A power distribution line consists of a number of such bus elements linked together.</p>
申请公布号 CA1038086(A) 申请公布日期 1978.09.05
申请号 CA19750238426 申请日期 1975.10.27
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 WARWICK, WILLIAM A.
分类号 H01L21/822;H01L21/60;H01L21/82;H01L23/538;H01L27/00;H01L27/02;H01L27/04;(IPC1-7):05K1/04 主分类号 H01L21/822
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