| 发明名称 |
MANUFACTURE OF MOLDDTYPE SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE:To economize the materials as well as to reduce the cut-off process, by reducing the lead frame width through movement of the position matching hole and also reducing two cut-off areas down to one area.</p> |
| 申请公布号 |
JPS53101272(A) |
申请公布日期 |
1978.09.04 |
| 申请号 |
JP19760160270 |
申请日期 |
1976.12.29 |
| 申请人 |
FUJITSU LTD |
发明人 |
MUGITANI HIROSHI;FUJIWARA HIROYOSHI;TAKAHASHI KAZUYA;TOMIKI MUNEYASU;SANO YOSHIAKI |
| 分类号 |
H01L23/48;H01L21/56;H01L23/08;H01L23/12 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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