发明名称 WAFER DICING DEVICE
摘要 <p>PURPOSE:To make possible cutting without damaging teeth despite presence of some variations in wax layer thickness and scribe depth by forming grooves at intervals according to pellet sizes and at a width greater than the cutting tooth width.</p>
申请公布号 JPS53100766(A) 申请公布日期 1978.09.02
申请号 JP19770014975 申请日期 1977.02.16
申请人 HITACHI LTD 发明人 KIYONO MASAMI
分类号 H01L21/301;H01L21/302;H01L21/78 主分类号 H01L21/301
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