| 发明名称 |
Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits |
| 摘要 |
A process is disclosed comprising laminating an anodically treated aluminum surface against a thermoset plastic substrate, whereby the surface of the substrate after chemically removing the aluminum has an improved affinity for the adherence thereon of electrolessly deposited metal films.
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| 申请公布号 |
US4110147(A) |
申请公布日期 |
1978.08.29 |
| 申请号 |
US19770756428 |
申请日期 |
1977.01.03 |
| 申请人 |
MACDERMID INCORPORATED |
发明人 |
GRUNWALD, JOHN J.;D"OTTAVIO, EUGENE D.;RHODENIZER, HAROLD L.;LOMBARDO, MICHAEL S. |
| 分类号 |
B32B15/08;H05K3/18;H05K3/38;(IPC1-7):C09J5/00 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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