发明名称 |
METHOD OF AND DEVICE FOR MOUNTING DEVICE ON SUBSTRATE |
摘要 |
The invention relates to a method and apparatus which is intended to equip a support substrate with integrated circuit devices of different kinds mounted originally on films. The apparatus includes a machine having cutting heads each associated with the film, and soldering heads. The substrate is mounted on a plate which is movable on a table in a direction perpendicular to the movement of the table, which movement takes place on a threaded spindle drive by a motor. The operation of the machine is monitored and controlled by a unit such as a computer. The invention is applicable in particular to mounting such devices on substrates intended for data-processing assemblies. |
申请公布号 |
JPS5397369(A) |
申请公布日期 |
1978.08.25 |
申请号 |
JP19770151839 |
申请日期 |
1977.12.19 |
申请人 |
CII |
发明人 |
JIYOSEFU ANDORE YUGU;PIEERU RUI SHIGERU;REIMON RUI DERORUMU;MOORISU RUNE DEBUOWARU;ANRI GUROSUJIYAN |
分类号 |
H05K13/04;B23K3/08;G05D3/12;H01L21/00;H01L21/60;H05K3/34;H05K13/00 |
主分类号 |
H05K13/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|