发明名称 ACTIVATOR SOLUTIONS AND PROCESS OF PREPARATION
摘要 <p>Surface intended to be electrolessly metal plated, for instand? the surface of through holes of through hole printed circuit boards, are treated with a colloidal catalyst metal-free acid liquid solution of a soluble, lower alkanolmodified noble metal-tin chloride complex until the surface is rendered catalytic. The noble metal of the complex is a noble metal which is catalytic to the deposition of the metal destined to be electrolessly plated on the surface.</p>
申请公布号 CA1037019(A) 申请公布日期 1978.08.22
申请号 CA19740207545 申请日期 1974.08.22
申请人 ENTHONE, INCORPORATED (NEW YORK) 发明人 HAJDU, JUAN;FADGEN, EARL J.
分类号 C23C18/16;C23C18/28;C23C18/31;C23C18/40;C23C18/50;(IPC1-7):01J31/22;23C3/00 主分类号 C23C18/16
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