发明名称 |
ACTIVATOR SOLUTIONS AND PROCESS OF PREPARATION |
摘要 |
<p>Surface intended to be electrolessly metal plated, for instand? the surface of through holes of through hole printed circuit boards, are treated with a colloidal catalyst metal-free acid liquid solution of a soluble, lower alkanolmodified noble metal-tin chloride complex until the surface is rendered catalytic. The noble metal of the complex is a noble metal which is catalytic to the deposition of the metal destined to be electrolessly plated on the surface.</p> |
申请公布号 |
CA1037019(A) |
申请公布日期 |
1978.08.22 |
申请号 |
CA19740207545 |
申请日期 |
1974.08.22 |
申请人 |
ENTHONE, INCORPORATED (NEW YORK) |
发明人 |
HAJDU, JUAN;FADGEN, EARL J. |
分类号 |
C23C18/16;C23C18/28;C23C18/31;C23C18/40;C23C18/50;(IPC1-7):01J31/22;23C3/00 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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