| 摘要 |
Apparatus is disclosed for making electrical contact with test points, such as in a printed circuit, on a test member. A mounting is provided for the test member at a location for test. A plurality of spaced conductive probe heads each have, oppositely facing, a contact side and a bearing side and are arranged in an array corresponding to the test points on the test member. The contact sides are adjacent the test member location. At least one resilient member has one side adjacent the bearing sides of the probe heads. A backup plate has a bearing side adjacent the opposite side of the resilient member from the probe heads. Pressure is applied through the backup plate and the resilient member to the bearing side of the probe heads forcing the contact sides of the probe heads in the direction of the test member location. The backup plate is harder than and substantially more rigid than the resilient member but is sufficiently flexible so that with the probe heads in engagement with the test member the backup plate conforms to the shape of the facing surface of the test member and the resilient member deforms so that all of the probe heads are forced into engagement with test points on the test member.
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