Conductive path end region for soldering to semiconductor element - consists of narrow insertable section for terminal contact with adjacent wide reservoir section

摘要

The conductive path end region is intended for a hybrid circuit, and serves for soldering of a semiconductor element (5) according to reflow solder process in flip-chip technique. The end region consists of a narrow, finger-shaped inserting region (2b) for the terminal contact of the semiconductor element and an adjacent wider reservoir region (2a) for the excessive molten solder. The width of the reservoir region, between the inserting region and the conductive path proper (2), is about three times that of the finger-shaped inserting region. Typically the latter is 0.2 mm wide and 0.6 mm long, while the reservoir region is a square of 0.6 mm. The conductive path is 0.3 mm wide.