| 发明名称 |
PRODUCTION OF SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE:To facilitate element dicing by providing grooves on the boundaries of respective elements on the back of a Si substrate and making the thickness from the bottom of the grooves up to the surface 150mum.</p> |
| 申请公布号 |
JPS5389656(A) |
申请公布日期 |
1978.08.07 |
| 申请号 |
JP19770004701 |
申请日期 |
1977.01.18 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
OOTAKI KANAME |
| 分类号 |
H01L21/301;H01L21/302;H01L21/329;H01L21/78 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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