| 发明名称 |
PRODUCTION OF PACKAGE FOR SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:To achieve the improvement in bonding strength and air tightness by using a material of a specific quality for brazing material of brazing in the production of packages for semiconductors using quartz. |
| 申请公布号 |
JPS5387664(A) |
申请公布日期 |
1978.08.02 |
| 申请号 |
JP19770002615 |
申请日期 |
1977.01.12 |
| 申请人 |
NIPPON ELECTRIC CO |
发明人 |
NAGAO HIROYUKI;KATOU TAKESHI;ANAZAWA SHINZOU |
| 分类号 |
B23K35/30;B23K35/02;H01L23/02;H01L23/04 |
主分类号 |
B23K35/30 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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