| 摘要 |
Disclosed herein is a chip bonding unit including a collet for holding a semiconductor chip, a table or bed for mounting the chips and a working table for holding a base plate to which the chip is to be attached, said collet being capable of relative movement with respect to the bed and the working table. In the chip bonding system according to the present invention, a light source and a light receiving element are disposed for detecting a silhouette of the chip by means of the scanning of the surface of said chip by the light source so as to thereby confirm the configuration, position and angle of the chip. The relative motion of the collet and chip is controlled so that the chip comes to a normal position and, then, the chip is picked up by the collet. Finally, the relative position of the collet and the working table is controlled so that the chip is attached to a predetermined position on the base plate.
|
